Dimensions:
Technical Bulletins
Application Notes
KA Mics
SiSonicTM MEMS Microphone
Built on our CMOS/MEMS technology platform (originally launched in 2002), the SiSonicTM silicon-based microphone series is entering its fourth generation of development, with product shipments exceeding 800 million units to date. The proven and evolving design series continues to support high-performance, high-density innovation in such applications as cell phones, digital still cameras, portable music players, and other portable electronic devices.
Features
- Silicon structure for high degree of manufacturing repeatability and stable (predictable) acoustic performance
- Patented "free-floating" diaphragm is immune to shifts in microphone sensitivity caused by variable mechanical tension in traditional electret condenser microphone diaphragms
- Low mass, low size diaphragm produces excellent vibration sensitivity performance
- Excellent RFI and EMI suppression
- Excellent operating and storage temperature ratings -40C to 100C
- Versatile configuration and sound porting options for future microphone enhancements
- 45% less board space than 6x2.2 ECMs
- 30% lower profile height than ECMs
- RoHS Compliant and Halogen Free
- Highly shock resistant
- Ideally suited for high volume applications
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| SPM0404UD5 | 4.72mm X 3.76mm X 1.25mm | -42.0 | na | na | Omni-directional | 10000-65000 | na | na |
