Surface Mount MEMS Microphones
| » | New MaxRF models eliminate GSM/TDMA burst noise and provide wide-band RF noise suppression |
| » | UtlraMini footprint - less than 11.5mm2 (SPU Series) |
| » | Slim UltraMini footprint - less than 8.5mm2 (SPQ Series) |
| » | Digital mics eliminate analog noise |
| » | Integrated designs with differential or switchable gain |
| » | "Zero height" for thinnest ever designs |
Built on our CMOS/MEMS technology platform (originally launched in 2002), the SiSonic™ silicon-based microphone series is entering its fourth generation of development, with product shipments exceeding 800 million units to date. The proven and evolving design series continues to support high-performance, high-density innovation in such applications as cell phones, digital still cameras, portable music players, and other portable electronic devices.
Design variables include ever-smaller sizes, lower profiles and mounting options, increased output capacities, and new digital audio options that eliminate analog noise. For manufacturers, surface mount designs eliminate off-line subassembly production costs. Customized designs are supplied on tape-and-reel and can be run through standard automatic pick-n-place equipment during in-line surface mount manufacturing.
The microphones can also be integrated with our patented IntelliSonic™ software and special porting designs to provide a precisely customized sound.
SP Series