Surface Mount MEMS Microphones
| » | New digital mics eliminate analog noise |
| » | New integrated designs with differential or switchable gain |
| » | "Zero height" for thinnest ever designs |
| » | Original "mini" with footprint less than 18mm2 |
| » | RF Hardened products eliminate GSM/TDMA burst noise in handset designs |
Built on our CMOS/MEMS technology platform (originally launched in 2002), the SiSonic™ silicon-based microphone series is entering its fourth generation of development, with product shipments exceeding 400 million units to date. The proven and evolving design series continues to support high-performance, high-density innovation in such applications as cell phones, digital still cameras, portable music players, and other portable electronic devices.
Design variables include ever-smaller sizes, lower profiles and mounting options, increased output capacities, and new digital audio options that eliminate analog noise. For manufacturers, surface mount designs eliminate off-line subassembly production costs. Customized designs are supplied on tape-and-reel and can be run through standard automatic pick-n-place equipment during in-line surface mount manufacturing.
The microphones can also be integrated with our patented IntelliSonic™ software and special porting designs to provide a precisely customized sound.
SP Series