RF/Microwave Custom Solutions

Built to your exact specifications, Knowles' DLI brand of RF/Microwave custom solutions deliver reliable performance in demanding applications.

Precision RF Solutions, Engineered to Perform

Leveraging advanced thin‑film and substrate technologies, we support build‑to‑print designs that integrate precision passive components, controlled impedance features, and custom metallization. From prototype through production, our engineering and manufacturing expertise helps ensure consistency, scalability, and performance you can trust—optimized for size, frequency, and system requirements.

Our custom ceramics offer significantly better thermal performance than the majority of industry standard ceramics and have an added benefit of a sufficiently higher dielectric constant (K) allowing miniaturization opportunities and temperature stable performance.

Typical Applications:

Heat Sinks and Standoffs
Integrated Passive Components
Customer Resistor Capacitor Networks
Couplers, Power Combiners
EMI Filters
High Frequency Filters
Microwave Integrated Circuits (MIC)
Bias Decoupling and Filtering
Lumped Element Impedance Matching Network
PA Stabilization
Impedance Matching and Power Combining Network

Build-to-Print Solutions

Knowles' DLI brand of build‑to‑print solutions enable the design, manufacture, and test of custom RF and microwave circuits based on customer specifications, from prototype through high‑volume production. Using advanced thin‑film processes and a wide selection of ceramic and substrate materials, we support complex circuit designs that integrate passive components, custom metallization, and controlled electrical performance. This approach provides a reliable path for developing high‑frequency solutions optimized for size, performance, thermal management, and long‑term consistency in demanding applications.

Key Highlights:

Build‑to‑print thin‑film circuit manufacturing based on customer designs
Broad substrate and ceramic material selection for electrical and thermal optimization
Custom metallization schemes and fine‑line circuit features
Scalable manufacturing from prototype through production
Enhanced thermal performance vs. industry standard ceramics
High K ceramics for miniaturization and temperature stability

Heatsinks & Standoffs

Knowles' DLI brand of heatsinks and standoffs are thin‑film ceramic components designed to support thermal management and mechanical spacing in RF, microwave, and optoelectronic assemblies. Heatsinks are fully metallized to efficiently dissipate and absorb heat, while standoffs provide controlled spacing and electrical connectivity with minimal impact on circuit performance. Both solutions are custom‑tailored to customer specifications and commonly used in LED, laser diode, and photodiode applications where thermal conductivity, reliability, and precision are critical.

Key Highlights:

Thin‑film ceramic heatsinks and standoffs for thermal and mechanical support
Heatsinks fully metallized for efficient heat dissipation and electrical conductivity
Standoffs metallized on selected surfaces for controlled spacing and connectivity
Custom designs tailored to customer specifications
Commonly used in LED, laser diode, and photodiode assemblies

Mounting Shorts

Knowles' DLI brand of mounting shorts are thin-film ceramic components designed to provide reliable electrical grounding while mechanically supporting RF and microwave circuits. Manufactured using high-performance ceramic substrates and precision metallization, mounting shorts raise circuit assemblies off the mounting surface with minimal impact on RF performance. This enables improved packaging flexibility, consistent electrical contact, and stable mechanical support in space-constrained and high-frequency applications where grounding and isolation are critical.

Key Highlights

Thin‑film ceramic mounting shorts for RF and microwave circuits
Reliable electrical grounding with mechanical support
Minimal impact on RF performance at high frequencies
Precision metallization for consistent electrical contact
Compact, low‑profile designs for space‑constrained assemblies

Submounts

Knowles' DLI brand of ceramic submounts are designed as package bases that minimize thermal resistance between LED junctions and adjacent components, helping manage heat in high-performance assemblies. By reducing junction temperatures, submounts enable improved LED efficiency, brightness, color stability, and long-term reliability. Each submount is custom-tailored to customer specifications and manufactured using high-performance materials to support a wide range of thermal, mechanical, and application requirements.

Key Highlights:

Ceramic submounts that minimize thermal resistance at the device level
Improved LED efficiency, brightness, color, and reliability through lower junction temperatures
Custom designs tailored to customer specifications
Material options including quartz, alumina, aluminum nitride, kovar, and beryllium oxide
Applications such as heat sinks, standoffs, height matching, bonding pads, and jumpers
Custom sizes, shapes, and patterns available in thicknesses from 3 to 100 mils and beyond

Substrates

Knowles' DLI brand offers a broad range of high‑performance ceramic substrates engineered to support RF, microwave, and high‑reliability electronic applications. Available in a variety of materials, thicknesses, and surface finishes, these substrates provide an optimized foundation for thin‑film circuits, passive integration, and custom build‑to‑print designs. With excellent electrical stability, thermal performance, and mechanical consistency, Knowles substrates enable reliable performance in demanding, space‑ and power‑constrained environments.

Key Highlights:

Wide selection of ceramic substrate materials for RF and high‑reliability applications
Optimized electrical, thermal, and mechanical performance
Multiple thicknesses and surface finish options
Compatible with thin‑film circuits and passive integration
Suitable for custom and build‑to‑print designs